IC Assembly & Test

assembly and test assembly and test

Assembly & Test Services:

EquipIC supply chain provides test, sort, reliability tests, assembly and bumping services.

We will take care of all the needed validation and the full range of quality assurance activity to enable a smooth transition through production of first samples to successful and cost-effective high-volume production. This includes yield optimization, corner lot characterization, test time optimization and reliability tests.

Salland Engineering, Giga Solution Tech and NRFLab are our preferred test houses, experienced in developing test programs and testing our customers’ ASICs.

Our recommended methodology is to develop the test programs by professional test houses close to the design team. Test programs are validated and optimized by testing the initial production lots in the test house. Later on, when test time and yield stabilize, the test programs are ported to the foundry and to the package house for mass production.

Unisem, UTAC, AMKOR, ASE, HANA and other assembly houses are our selected partners for packaging our customers’ ICs. We are able to offer QFP, QFN and BGA bonding type packaging as well as bumping and Flip-Chip technologies.

Bulk Wafer Services:

EquipIC can provide the following wafer services:home3

  • wafer backgrind
  • gold bumping
  • solder bump
  • RDL design

Assembly / Test Partners:

unisem salland lmitech
NRF Lab UTAC ase
  • unfinished wafer package equipic supply chain
  • Latest News:

    Our new ISO9001 certificate is in
    ISO9001

    BCSEMI New Perspectives for the IC design community The Strip, Eindhoven March 28th 2019. We like to meet you!

    Embedded World 2019
    Thank you all for being there.

    DesignCon 2019:
    Santa Clara was again a very good conference, thank you!:

    EquipIC visited TEKNOWLOGY on November 8th 2018:
    TEKNOWLOGY
    is the Dutch festival where technology, science, innovation and valorisation meet.

    EquipIC has attended the GTC on October 12th 2018
    it was a good show, with interesting subjects like
    •FinFET, FDX™
    •IoT
    •5G/networking and automotive solutions
    •Mainstream CMOS for smart applications
    •Next age of Wireless/Optical connectivity

    EquipIC will attend the GTC on October 12th!
    GTC 2018 Munich, Germany, October 12, 2018.

    October 4th 2018 BCsemi invited delegation from Finland
    A visit from high tech people from Finland to the Netherlands. It was very a very good meeting with new insights.

    Holland High Tech October 2nd 2018
    We attended the Holland High Tech Top Sector Electronics the workshop Photonics and roadmap Electronics.

    ISO9001:2015 Certification is now official

    Quantum computing Juli 5th 2018
    We are going to the meeting to hear and talk about Quantum computing with TNO and peers in the industry, after this we will be engaged by the AI presentation from the University of Amsterdam.

    Good GSA show, thank you voor visiting
    Thank you all for visiting EquipIC at GSA Silicon Summit San Jose, California on Thursday, April 19, 2018