IC Assembly & Test

assembly and test assembly and test

Assembly & Test Services:

EquipIC supply chain provides test, sort, reliability tests, assembly and bumping services.

We will take care of all the needed validation and the full range of quality assurance activity to enable a smooth transition through production of first samples to successful and cost-effective high-volume production. This includes yield optimization, corner lot characterization, test time optimization and reliability tests.

Salland Engineering, Giga Solution Tech and NRFLab are our preferred test houses, experienced in developing test programs and testing our customers’ ASICs.

Our recommended methodology is to develop the test programs by professional test houses close to the design team. Test programs are validated and optimized by testing the initial production lots in the test house. Later on, when test time and yield stabilize, the test programs are ported to the foundry and to the package house for mass production.

Unisem, UTAC, AMKOR, ASE, HANA and other assembly houses are our selected partners for packaging our customers’ ICs. We are able to offer QFP, QFN and BGA bonding type packaging as well as bumping and Flip-Chip technologies.

Bulk Wafer Services:

EquipIC can provide the following wafer services:home3

  • wafer backgrind
  • gold bumping
  • solder bump
  • RDL design



Assembly / Test Partners:

unisem salland lmitech
NRF Lab UTAC ase
  • unfinished wafer package equipic supply chain
  • Latest News:

    EquipIC supply chain is now ISO 9001:2008 certified

    EquipIC supply chain attended the Wearable Technologies conference in Munich January 2016

    EquipIC supply chain attended the Design & Re-Use IP-conference in Grenoble December 2015

    EquipIC supply chain attended the eSAME conference in Sophia-Antipolis, November 2015

    EquipIC supply chain attended Design Con 2015 – Where the chip meets the board, at the Santa Clara Convention Center, Jan 2015.